Prime Minister Narendra Modi on Wednesday virtually laid the foundation stone of three semiconductor projects worth about Rs 1.25 trillion, including the Rs 91,000 crore facility in Dholera, which will commence chip production by 2026.
“India is set to become a prominent semiconductor manufacturing hub. The three facilities will drive economic growth and foster innovation,” Prime Minister said, adding that, the 21st centrury is electronically driven and it can’t be imagined without the semiconductor chips.
“During the first three industrial revolutions, India was lagging due to various reasons, but the country is moving with confidence towards achieving milestones in Industry 4.0,” Prime Minister Narendra Modi said.
Two of the three facilities are located in Gujarat, whereas one is based in Assam. The three projects are the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) in Gujarat, the Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam, and an OSAT facility in Sanand in Gujarat.
While laying the foundation stone of the three new semiconductor projects through video conferencing, the prime minister said: “The projects announced today will help India to become a global semiconductor hub. These three semiconductor facilities will drive economic growth and foster innovation in the country”.
